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Workshop on 3D Face Biometrics In conjunction with the 10th IEEE International Conference on Automatic Face and Gesture Recognition (FG 2013)

5 Octobre 2012


Catégorie : Conférence internationale


Workshop on 3D Face Biometrics
In conjunction with the 10th IEEE International Conference on Automatic Face and Gesture Recognition (FG 2013)

Shanghai, China – April 22-26, 2013
http://www.ivl.disco.unimib.it/3DFB

 

Call for papers

Advances during the last decades have made high quality acquisition of 3D faces a reality. 3D scanning devices are now available not only in the form of Hi-res scanner which are able to acquire registered texture and range data from static environments but also 4D scanning devices that are able to acquire range data over time so as to capture the dynamics of 3D. In the meantime, much progress has been achieved in 3D face analysis and recognition methods, albeit in very controlled settings. Some topics, however, have yet to be thoroughly explored. On the one hand, the availability of Hi-res data from the environment is expected to boost the accuracy of recognition systems. On the other hand, the availability of a broad range of devices, differing in terms of resolution, poses new challenges and research issues addressing not only the impact of low resolution data on the recognition accuracy but also the integration and combination of different modalities – 2D still, 2D video, 3D still, 3D video – to improve the recognition accuracy. Furthermore, it has been shown that “soft” biometrics (gender, age, ethnicity, etc.) can complement the identity information provided by other biometrics to improve the accuracy of recognition. This workshop focuses on 3D face analysis and recognition and is particularly aimed at exploring ways to extract and effectively exploit still as well as dynamic facial features for recognition. Areas of coverage include, but are not limited to, 3D face detection, analysis, and recognition; gender, ethnicity and age classification from 3D data; analysis of facial expressions; multimodal 2D/3D face recognition; super-resolution facial models.

Topics of interest

  • 3D Face recognition;
  • 3D Face detection;
  • Gender/ethnicity Classification;
  • Age estimation;
  • Analysis of facial expressions;
  • 2D+3D and multi-modal face recognition;
  • Matching partial or deformed 3D face scans;
  • Person recognition in images and videos using 3D face models;
  • 3D facial behaviors;
  • Dynamic 3D face processing and analysis;
  • Super-resolution models for 3D faces;
  • Indexing and management of large 3D face datasets.

Important dates

Submission deadline: November 15, 2012
Review of submissions: November 16 through December 15, 2012
Acceptance notification: December 20, 2012
Camera-ready workshop paper due: January 10, 2013

Submission Instructions

Papers should be prepared according to the IEEE specification. General info and the templates can be found at the Workshop website. Submissions may be up to eight pages in conference paper format. Papers longer than six pages will be subject to a page fee for the extra pages (two max). Submissions may be in doc, docx, or pdf format, and are limited to a 10MB file size.

All papers will receive a "double blind" peer-review. Therefore, submissions should be appropriately anonymized to not reveal the authors or authors' institutions.

The workshop website

Further information on the workshop can be found at http://www.ivl.disco.unimib.it/3DFB .

Organizers

  • Liming Chen, University of Lyon, Ecole Centrale de Lyon, France (principal contact)
  • Raimondo Schettini, University of Milano – Bicocca, Italia
  • Pietro Pala, University of Firenze, Italia
  • Ioannis A. Kakadiaris, University of Houston, USA
  • David Xianfeng Gu, State University of New York at Stony Brook, USA
  • Claudio Cusano, University of Milano – Bicocca, Italia
  • Mohamed Daoudi, Telecom Lille 1/LIFL (UMR 8022), France
  • Yunhong Wang, Beihang University, China

Program Committee

  • Mohsen Ardabilian, University of Lyon, École Centrale de Lyon, France
  • Boulbaba Ben Amor, Télécom Lille 1, France
  • Mohammed Bennamoun, The University of Western Australia, Australia
  • Stefano Berretti, University of Firenze, Italia
  • Michael M. Bronstein, Technion, Israel
  • Kevin W. Bowyer, University of Notre Dame, USA
  • Rama Chellappa, University of Maryland, USA
  • Alberto del Bimbo, University of Firenze, Italia
  • Emmanuel Dellandréa, University of Lyon, École Centrale de Lyon, France
  • Hassan Drira, Telecom Lille 1, France
  • Jean-Luc Dugelay, Eurecom, France
  • Christophe Garcia,University of Lyon, INSA-Lyon, France
  • Stéphane Gentric, Morpho, France
  • Faouzi Ghorbel, ENSI, Tunisia
  • Abdenour Haddid, University of Oulu, Finland
  • Di Huang, Beihang University, China
  • Hongying Meng, Brunel University, UK
  • Jean-Marie Morvan, University of Lyon Claude Bernard, France
  • Sami Romdhani, Morpho, France
  • Albert Ali Salah, Bogazici University, Turkey
  • Dimitris Samaras, State University of New York at Stony Brook, USA
  • Bülent Sankur, Bogazici University, Turkey
  • Gang Pan, Zhejiang University, China
  • Remco Veltkamp, Universiteit Utrecht, Netherlands
  • Shishir Shah,University of Houston, USA
  • Theoharis Theoharis, University of Athens
  • Wei Zeng, State University of New York at Stony Brook, USA
  • Lijun Yin, Binghamton University, USA
  • Stefanos Zafeiriou, Imperial college, UK
  • Zhengyou Zhang, Microsoft, USA
  • Xi Zhao, University of Houston, USA